主 持 人：施勝雄
This project aims to combine MEMS process with micro electroforming technology to fabricate vertical spring-probe, which can be applied to wafer level probe card due to its large flexibility. The features of this kind of probe card include using thick layer PR photolithography process, applying micro electroforming process and producing a large number of probe cards with large accuracy at the same time. We use the FEA software, COSMOS, to simulate different kinds of stress and deformation under different contours of probes so that we can reduce the design time. Both design and fabrication of the alloy electroforming facility are also finished by us. So far we have successfully finished producing Ni-Fe and Ni-Co probes.
The required specifications of the probe have been measured in this study, especially the probe’s Young’s module, hardness, maximum current, life time and resistivity. We assemble a complex measurement that include of PIC microchip to build the controller circuit of this testing equipment that can make the related testing information display by the LCD screen and can be operated automatically as well. The other advantages of this testing machine include “Set reciprocal motion of million times”, “Contact with tested probes”, “Communicate with RS232 interface” etc. Furthermore, we can change any functions of the testing equipment by altering firmware without changing any hardware, for example, it can measure the probe’s maximum current and spring constant. This testing machine achieves high speed response with low testing time because we use voice coil motor to substitute for traditional mechanical design in the aspect of reciprocal mechanism. In addition, we add on a force sensor to probe contact surface such that the probe reacting force can be obtained when the probe contacts with surface.