垂直式微小探針性質測試、組裝及其陣列式力量感測器設計
 

The Research and Fabrication of MEMS Vertical Probe Card by Using Alloy Electroforming Technology 

指導教授 : 黃榮堂、施勝雄  研究生 : 林忠義  製造科技研究所 94年


摘要

  本論文使用微機電製程(MEMS)搭配微電鑄(Micro Electroforming)技術製作垂直式探針,使其具有最大的柔順度,可應用在晶圓級探針卡。探針外型設計使用有限元素分析(FEA)軟體COSMOS模擬不同型態探針的應力與變形,以縮短開發時程。其製程特徵為使用微影技術搭配厚膜光阻,再使用微電鑄技術、研磨技術的製作方式,可批量生產高精度探針。鎳鈷合金電鑄與研磨拋光相關設備,技術自組性高、關鍵技術能夠自行掌握。目前可以製造高精度之鎳鈷合金探針。
  探針測試也是重要的一環,因此必須開發探針測試機台,以便進行探針疲勞測試、最大耐電流測試、阻值與溫度關係量測、針壓測試。此不需要改變硬體情況下,變更韌體即可改變測試機台的功能,順應不同場合的需求。
  另外,微探針組裝技術,為本研究的突破技術之一,利用微影製程的優勢,可將製程延伸,達到多根針的封裝技術,因此可降低因人工排列探針而共面度無法提升等問題。搭配陣列式力量感測器於探針裝配頂部,當探針發生接觸時,可進行即時探針反作用力、接觸電阻的檢測,如此一來可大幅降低修復探針卡所需的時間與人力,為技術上的一大突破。
 

關鍵詞:微機電、鎳鈷合金電鑄、探針測試、微探針組裝、研磨、力量感測器

ABSTRACT

 This thesis aims to combine MEMS process with micro electroforming technology to fabricate vertical spring-probe, which can be applied to wafer level probe card due to its large flexibility. The features of this kind of probe card include using thick layer PR photolithography process, applying micro electrofrming process and producing a large number of probe cards with large accuracy at the same time. We use the FEA software, COSMOS, to simulate different kinds of stress and deformation under different contours of probes so that we can reduce the design time. Both design and fabrication of the alloy electroforming facility are also finished by us. So far we have successfully finished producing Ni-Fe and Ni-Co probes.
 The probes testing is another key requirement in this study, so we have no choice but to develop a testing equipment for probes in order to perform fatigue testing of probes. We take advantage of the conception of PIC microchip to build the controller circuit of this testing equipment that can make the related testing information display by the LCD screen and can be operated automatically as well. The other advanges of this testing machine include “Set reciprocal motion of million times”, “Contact with tested probes”, “Communicate with RS232 interface” etc. Furthermore, we can change any functions of the testing equipment by altering firmware without changing any hardware, so as to cater for different requirements. This testing machine achieves high speed response with low testing time because we use voice coil motor to substitute for tranditional mechanical design in the aspect of reciprocal mechanism. In addition, we add on a force sensor to probe contact surface such that the probe reacting force can be obtained when the probe contacts with surface.

Key Words: MEMS, Alloy Electroforming, Probe Testing Meachine, Voice Coil Motor, Probe, Ni-Fe, Ni-Co