This paper combines MEMS process with micro electroforming technology to fabricate vertical spring-probe, which can be applied to wafer level probe card due to its large flexibility. The feature of this kind of probe card include using thick layer PR photolithography process, applying micro electrofrming process and producing a large number of probe cards with large accuracy at the same time. We use the FEA software, COSMOS, to simulate different kinds of stree and deformation under different contours of probes so that we can reduce the design time. Both design and fabrication of the alloy electroforming facility are also finish by ourselves, and it has two advantages as high assembly technology and key point controlled by ourselves. So far we have successfully finished producing Ni-Fe and Ni-Co probes.
The probes testing is another key point in this study, so we have no choice but to develop a testing equipment for probes in order to perform fatigue testing of probes. We take advantage of the conception of PIC microchip to build the controller circuit of this testing equipment that can make the related testing information display by the LCD screen and can be operated automatically as well. The other advanges of this testing machine include “Set reciprocal motion of millon times”,”Contact wth tested probes”,”Communicate with RS232 computer” etc. Furthermore, we can change any functions of the testing equipment by altering firmware without changing any hardware, so as to cater for different requirements. This testing machine link up high speed response with low testing time because we use voice coil motor to substitute for tranditional mechanical design in the aspect of reciprocal mechanism. Besides, Build pressure sensor on the top of voil coil motor while pressure sensor is contacted with its surface, reacting force can be examined to get the result of relations between displacement and reacting force.
Keywords：MEMS, Alloy Electroforming, Probe Testing Meachine, Voice Coil Motor