快速與局部加熱於陽極接合品質的研究應用

Rapid and locally selective bonding of Anodic Bonding

指導教授 : 黃榮堂、陳正光   研究生 : 楊學安  製造科技研究所 91年


摘要

  陽極接合技術是目前在微機電製程技術中相當重要的一種接合技術,主要用於玻璃與矽晶片的接合,屬於無介質的接合技術,由於兩層材料中間並無任何介質,所以其表面平整度要求相當高,這兩個接合面,其表面粗度必須小於1微米,才能使此兩個接合面緊密的貼在一起,否則在接合時介面處將發生氣孔而影響接合品質,針狀式的上電極有助於解決氣泡的問題,其方式主要是由中央處開始接合至晶片邊緣,可將介面的氣泡由內趕出,但接合速度相當慢,平板式的上電極可大面積的快速接合,但接合品質相當不好,本文將提出一種新式多電極的接合方式利用特殊的幾何排列方式,來改善陽極接合的速度及接合品質,經由實際的實驗證明這樣設計的電極的確可改善接合時間與品質。
此外本片論文也提供一種新的方式,利用電磁感應線圈可快速升溫的優點來輔助陽極接合使其達成局部加熱接合的效果,首先將磁性材料如(鐵、鈷、鎳)鍍於所要接合的區域,之後將高週波感應線圈移至磁性材料的附近,這會使這個區域的溫度在幾秒鐘便能迅速的升至可接合的溫度,而其他區域還保持在環境週遭的溫度,由此種方式便能達到局部加溫接合的目的

ABSTRACT

  The anodic bonding, a non-intermediate bonding technology that is mainly used in glass to silicon wafer bonding, has become one of the important steps in the manufacturing process of MEMS (Microelectromhanical Systems). As a result of tight bonding without any intermediate between two layers of material, the surface roughness of the wafer must be less than 1μm. Otherwise, it will produce gas trapping in the bonding interface and affect the bonding quality. The point electrode can solve the gas-trapping problem, because the way of bonding region starting from the cathode tip and middle of the wafer, can avoid the product of gas trapping; however, the bonding time is too slow. The planar cathode can make large bonding area in short time, but the bonding quality is not quite well. This paper presents a new method of using multiple point electrodes in a spiral arrangement which is not only solving the gas-trapping problem, but also significantly reducing the bonding time in anodic bonding.
In addition, this paper also presents a novel method to establish a local anodic bonding of silicon to glass with induction heating. In order to specify the locally selective bonding region, the induction heating magnetic materials, such as Fe, Co, Ni are deposited on the designated region. Then, the induction coils are moved near closed to the coated region and a HF power is provided. The results showed the temperature of the zone coated with magnetic materials rise to bond temperature only within several seconds to finish the local bonding, even the other region still keep around the room temperature.