Design of a Precious Diamond Wire Cutting Machine
指導教授 : 黃榮堂 研究生 : 鄭宜昇 機電整合研究所 90年
This study attempts to develop a kind of machine tools, which is able to
cut nonconducting material. Its cutting precision shall be able to be compared
with traveling-wire electrical discharge machining, but can also cut nonconducting
materials. This machine tool is a kind of NC machine tool using PC-based controller,
used to cut some projected shapes which can be defined on a single axis, X-Y dual
axes or multiple axis. The said machine is to use one diamond wire loop with motion
on direction of Z-axis or a certain direction, to attain the function of cutting.
This cutting machine includes top and bottom wire guide pulley which are installed
upper and lower the workpiece, surround the diamond wire, expect to be able to
support the reaction force incurred during component cutting by the diamond wire.
This machine also includes an auto wire tension control mechanism. While diamond
wire saw is cutting, it could be able to maintain a constant wire tension. Thus,
the wire could be kept as straight as possible and not to cause shifting from
the feeding direction. Besides, a tension sensor is also installed over the roller,
used to know the cutting force and reactions of a component so as to adjust the
drawing speed and feed speed. For a long time, most of the material used to make
a die is conductive material. In the recent yeas, such nonconducting materials
as ceramics and composites have also been massively applied, however a difficult
issue of how to cut into the desire shape is encountered. The theory and technology
developed in this study, if applied to design a single-axis machine tool, can
focus on column slicing, such as a silicon wafer. If applied to design a machine
tool of dual axes or multiple axis, it can cut a more complicated shape.